Custom development process
We start with your equipment environment and target conditions, then refine specifications through design and sample evaluation. Review scope and steps depend on the product.
- 01
Requirements
Confirm equipment, product dimensions, process issues and target conditions.
- 02
Engineering review
Assess feasibility and the required development scope.
- 03
Design & samples
Review structures and materials, then build evaluation samples.
- 04
Evaluate & refine
Incorporate customer process evaluation results and improvement requests.
- 05
Supply & support
Supply to agreed specifications and provide follow-up technical support.
Process improvement examples
HBM thin die pickup
- Process need
- A die separation structure is needed for the bump surface and pickup conditions.
- Engineering approach
- Ejector and M-Collet design review
- Application & evaluation
- Development and production application are documented in the source presentation.
Eject Hood improvement
- Process need
- Review replacement scope for integrated hoods and component differences between equipment models.
- Engineering approach
- Detachable hood and common body
- Application & evaluation
- A structure that reduces replacement parts. The extent of improvement requires evaluation for each equipment configuration.
Wafer Chuck Table
- Process need
- Review wafer thickness variation and the support structure.
- Engineering approach
- Chuck structure, bonding method, mounting and water inlet review
- Application & evaluation
- Test results are included in the source material; TTV is evaluated under actual process conditions.
Custom Saw Kits
- Process need
- A changeover is needed to accommodate new package dimensions and layouts.
- Engineering approach
- Picker, chuck table and other kit component design
- Application & evaluation
- Custom kit production applications are documented in the source presentation.
DEVELOPMENT ROADMAP
Development for advanced packaging
Reference date 2026.09.23. These are development targets from the presentation, not completed milestones or supply commitments.
HBM TC Bonder · Interconnection
Development of HBM stacking TC bonding and an Impulse Printing Interconnection Module
Saw automation options
Development of AI Vision and OHT/AMR logistics automation support
2.5D·FO-WLP Bonder
MCPD-1 configurations for diverse dies, substrates and high-precision bonding
Hybrid Bonding · Inspection & cleaning
Hybrid bonders, wafer/bump inspection, laser and CO₂ cleaning, and interconnection technology