We analyze die separation, pickup, bonding and tool change requirements, then develop structures and specifications for your equipment environment.
Thin die handling
Ejector and collet structures for thin die separation and pickup, considering die thickness, bump conditions and equipment motion together.
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Automatic tool change
Tool change structures and equipment integration for collets and ejectors, including one-touch designs and tool supply/retrieval during operation.
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Custom process components
Parts designed for equipment models and device conditions to support product changeovers and existing kit improvements.
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Advanced packaging components
Thermal control and ceramic tools for bonding processes, with material properties and contact geometry evaluated under customer process conditions.
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