Semiconductor equipmentProduction quality qualification complete
A die bonder for precision thin die stacking and automatic tool changes
Picks individual dies from a wafer and bonds them to a substrate. Dual pickup and dual bond heads support NAND and DRAM stack die bonding processes.
- Model / product family
- ZSD-1
- Application process
- Die Bonding
- Status reference date
- 2026.09.23
Key features
01
Dual Pick-up Head / Dual Bond Head
02
High-rigidity frame and full closed-loop motion control
03
Automatic collet and ejector dome changes
04
Tool supply and retrieval during operation
Specifications
- Model
- ZSD-1
- Dimensions (W × D × H)
- 2,567 × 1,659 × 1,950 mm
- Die thickness / stack
- 30 μm / 32 Stack
- Bonding accuracy
- XY ±4 μm @ 5σ / θ ±0.05° @ 5σ
- Throughput
- DRAM 4K UPH / NAND 3K UPH
- Thin Die Ejector
- VMS (Full Auto Control) / EMS
- Head configuration
- Bond Head Dual / Pick-up Head Dual
The source states that development and production quality qualification are complete. Throughput and accuracy depend on die, substrate and stacking conditions; confirm application conditions before adoption.
Options & customization
Discuss needle and needleless multi-stage configurations, plus collet changes for bond heads, pickup heads and the middle stage.
Request an application review