TECHNICAL RESOURCES

Technical resources

Information to support product selection and process evaluation.

Review product selection criteria for your equipment and process. Contact us for detailed drawings and evaluation data.

PDF

FLC Company & Product Guide

All products · English · Revised October 26, 2026 · Product information as of 2026.09.23

Download ↓
TXT

Product Selection & Technical Inquiry Checklist

All products · English · Revised October 26, 2026 · Equipment and process worksheet

Download ↓

Detailed product information

Tell us which product and application you are considering if you need specifications, drawings or material evaluation data. We will advise which documents are available.

Request documents

Certification documents

Contact us for company certification documents. We will confirm the certification name and validity period before providing the relevant information.

Ask about certifications

Product selection criteria

Ejector·Collet
Die dimensions/thickness, bump conditions, vacuum pattern, equipment model and motion
Back Grind Parts
Wafer size, equipment model, P.C.D holes and cooling water inlet position
Saw Kit
Package dimensions/layout, equipment structure and vacuum/transfer conditions
Ceramic components
Target temperature and cycle, contact geometry, material and surface resistance
EMI Back Plate
Equipment, target, material, dimensions and mounting structure

CONNECT WITH FLC

Better semiconductor processes, developed together.

Contact us