SEMICONDUCTOR EQUIPMENT

Semiconductor equipment

Equipment for precision die stacking and package singulation.

Explore FLC equipment, replacement tools and core components by product type and application process.

Application processSearch products

Total 4 products

Product status as of: 2026.09.23

ZSD-1

Production quality qualification complete

Stack Die Bonder

A die bonder for precision thin die stacking and automatic tool changes

Die Bonding

TC / Hybrid

In development

Bonding equipment development for HBM stacking

HBM & advanced packaging · Die Bonding

MCPD-1

In development

High-precision bonding equipment for advanced packaging

HBM & advanced packaging · Die Bonding

Saw Singulation

Contact for supply details

Saw singulation equipment for package cutting and sorting

Saw Singulation

Status and specifications are based on the product presentation. Contact us to confirm current availability and application conditions.

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