Semiconductor equipmentIn development
High-precision bonding equipment for advanced packaging
Under development for applications including 2.5D and FO-WLP. Face-up and face-down configurations are being reviewed for different die and substrate conditions.
- Model / product family
- MCPD-1
- Application process
- HBM & advanced packaging / Die Bonding
- Status reference date
- 2026.09.23
Key features
01
Face-up / Face-down configurations
02
Stage and head heater options
03
Multiple bond force ranges
04
Ejector and collet auto changer options
Development targets & specifications
- Model
- MCPD-1
- Target processes
- 2.5D / FO-WLP / HBM·CoWoS·PLP
- Die size (target)
- 1–30 mm
- Die loading (target)
- 12-inch wafer / Optional tray and tape & reel
- Face-down accuracy (target)
- XY ±1 μm @ 3σ · Local Alignment
- Heater (target)
- Stage RT–150 ℃ / Head RT–450 ℃
- Bond force options (target)
- 0.5–50 N / 2–200 N / 10–500 N
- Development target
- Q3 2027
These figures are development targets from the presentation. Final supply specifications and timing may change with development and evaluation results.
Options & customization
We review flux dipping, tool parallelism adjustment, automatic changes and substrate-specific configurations.
Request an application review