Semiconductor equipmentIn development
Bonding equipment development for HBM stacking
Chip-to-wafer TC and hybrid bonding equipment under development for HBM packaging, considering die handling, bonding and thermal control together.
- Model / product family
- TC / Hybrid
- Application process
- HBM & advanced packaging / Die Bonding
- Status reference date
- 2026.09.23
Key features
01
Chip-to-wafer TC bonding development
02
Hybrid bonding development
03
Die handling and thermal control for HBM stacking
Development targets & specifications
- TC bonding target applications
- HBM3E / HBM4
- Hybrid bonding target applications
- HBM5 / HBM6
- Development scope
- Die handling / Bonding / Thermal control
HBM generation support is a development target, not an indication of completed commercial availability. Contact us for schedules and evaluation conditions.
Options & customization
We review joint development and application feasibility for the stacking structure and thermal conditions of your process.
Request an application review