Semiconductor equipmentContact for supply details
Saw singulation equipment for package cutting and sorting
Separates molded substrate packages into individual units and sorts them. Uses dual spindle and dual chuck table configurations.
- Model / product family
- Saw Singulation
- Application process
- Saw Singulation
- Status reference date
- 2026.09.23
Key features
01
Dual Spindle / Dual Chuck Table
02
In-house spindle and conversion kit design
03
Sorting by package characteristics after singulation
04
Consult on replacement parts and logistics automation
Specifications
- Dimensions (W × D × H)
- 4,365 × 1,870 × 1,900 mm
- SAW Offset
- XY ±0.05 mm @ 3σ
- Throughput (source figures)
- DRAM 28K / NAND 25K UPH · BIN Sorting
- Spindle speed
- 20,000–60,000 RPM
- Saw Head / Chuck Table
- Dual / Dual
- Options in development
- AI Vision / OHT and AMR support · Target Q2 2027
Confirm equipment availability and the implemented scope of each option during consultation. AI Vision and OHT/AMR support are development items in the source presentation.
Options & customization
Package dimensions, sorting conditions, blade/chuck change configurations and logistics automation are reviewed individually.
Request an application review