Ceramics & materialsSample evaluation
Ceramic heaters for rapid heating and cooling in bonding
Ceramic pulse heaters are being developed for semiconductor packaging processes such as TC bonding. Thermal control characteristics and process conditions are evaluated together.
- Model / product family
- Ceramic Heater
- Application process
- HBM & advanced packaging
- Status reference date
- 2026.09.23
Key features
01
Rapid heating and cooling
02
Thermal control for bonding
03
Evaluation by heater size and cooling conditions
Specifications
- Applications
- HBM Chip / Flip Chip / ACF Bonding
- Evaluation criteria
- Temperature range / Heating and cooling cycle / Durability
- Development stage
- Sample evaluation
Heating and cooling performance depends on test conditions including heater size and cooling method. Specifications are provided after confirming evaluation conditions.
Options & customization
Discuss sample evaluation based on heater geometry, target temperature, heating/cooling cycle and process environment.
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