Process parts & toolsIn production use
An ejector for thin die separation and component changeovers
A core die bonder component that separates thin dies from a wafer. A common body, device-specific detachable hood and one-touch change structure support different equipment and process conditions.
- Model / product family
- EMS / Hood Type
- Application process
- Die Bonding / HBM & advanced packaging
- Status reference date
- 2026.09.23
Key features
01
Common body for each equipment model
02
Device-specific detachable hood
03
One-touch change structure
04
Single-axis and four-axis drive support
Specifications
- Applications
- NAND / DRAM / HBM Thin Die
- Structure
- Common body + Device-specific hood
- Drive configuration
- Single-axis motor / Four-axis motors
- Review conditions
- Die dimensions/thickness / Bumps / Motion / Equipment model
Development is complete and production use is documented in the source. Die thickness and pickup performance require review for the target device and equipment.
Options & customization
Hood and ejector structures are designed for thin die pickup conditions, bump surfaces and equipment motion. Existing kit improvements can also be discussed.
Request an application review