Ceramics & materialsSample evaluation
Ceramic pick & place tools for advanced packaging
Ceramic tools for HBM and 2.5D/3D packaging equipment. Development considers thermal conductivity, hardness and electrical properties for the process.
- Model / product family
- Pick & Place Tool
- Application process
- HBM & advanced packaging / Die Bonding
- Status reference date
- 2026.09.23
Key features
01
Thermal, mechanical and electrical property review
02
Material property and durability evaluation
03
Contact geometry and surface resistance design
Specifications
- Applicable equipment
- HBM / 2.5D·3D Die Bonder
- Specification review
- Material / Geometry / Contact design
- Evaluation criteria
- Thermal conductivity / Hardness / Surface resistance / Durability
In sample evaluation. Material values and service life are provided after confirming comparison criteria and test conditions.
Options & customization
Contact geometry, materials and electrical properties are reviewed for your bonding conditions.
Request an application review