Process parts & toolsIn production use
Magnetic collets for die pickup and bonding
One-touch magnetic holders and collets provide tools for die characteristics and usage positions, with automatic change structures and a range of vacuum patterns.
- Model / product family
- M-Collet
- Application process
- Die Bonding / HBM & advanced packaging
- Status reference date
- 2026.09.23
Key features
01
One-touch Magnetic Holder
02
Pickup / Bond / Middle stage configurations
03
Line Hole·Pin/Hole·Pyramid·Flip Chip·Custom
04
Vacuum patterns designed for die characteristics
Specifications
- Product configuration
- Magnetic holder / Collet / Automatic change parts
- Reference holder configuration
- 14 × 19 Fixed Type
- Usage positions
- Pick-up Head / Bond Head / Middle Stage
- Selection criteria
- Die dimensions/thickness / Hardness / Material / Surface resistance / Coating
Development is complete and production use is documented in the source. Equipment mounting structures and automatic change compatibility are checked individually.
Options & customization
We review HBM and flip chip tools, vacuum holes and line patterns for your process. Part codes and detailed drawings are available through consultation.
Request an application review