
ZSD-1
Production quality qualification completeStack Die Bonder
A die bonder for precision thin die stacking and automatic tool changes
FLC SEMICONDUCTOR SOLUTIONS
From Die Bonding to Saw Singulation.
Products and engineering tailored to
your equipment and process requirements.

OUR BUSINESS
Developing equipment, process parts and core materials together.

We develop die bonders and saw singulation equipment for precision die stacking and package separation.

We supply ejectors, collets and conversion kits tailored to production requirements.

We develop components for thermal control, die handling and EMI shielding in advanced packaging.
FEATURED PRODUCTS

ZSD-1
Production quality qualification completeA die bonder for precision thin die stacking and automatic tool changes

EMS / Hood Type
In production useAn ejector for thin die separation and component changeovers

M-Collet
In production useMagnetic collets for die pickup and bonding

Custom Conversion Kit
In production useSaw conversion kits for equipment and package specifications
Product status is based on the September 23, 2026 presentation. Please contact us to confirm current supply conditions.
TECHNOLOGY & DEVELOPMENT
We analyze die separation, pickup, bonding and tool change requirements.
We develop structures and specifications for your equipment environment.
ABOUT FLC
Founded in 2020, FLC develops semiconductor and display equipment and components. We focus on equipment development, domestic component manufacturing and custom engineering.
CompanyLET’S WORK TOGETHER
Talk to us about product selection, existing equipment improvements and new component development.
CONNECT WITH FLC