FLC SEMICONDUCTOR SOLUTIONS

Semiconductor equipment.
Core components. FLC.

From Die Bonding to Saw Singulation.
Products and engineering tailored to
your equipment and process requirements.

PRECISION CONNECTS POSSIBILITY
STACK DIE BONDING +
FLC Stack Die Bonder ZSD-1 equipment
ZSD-1Dual Head · Automatic Collet / Ejector Change
EQUIPMENT. PARTS. PROCESS SOLUTIONS.Explore our business ↓

FEATURED PRODUCTS

Products built for production needs

View all 11 products

Product status is based on the September 23, 2026 presentation. Please contact us to confirm current supply conditions.

TECHNOLOGY & DEVELOPMENT

Precision in every die movement.
Designed for your process.

We analyze die separation, pickup, bonding and tool change requirements.
We develop structures and specifications for your equipment environment.

Explore core technologies

ABOUT FLC

Equipment and components,
built around your process.

Founded in 2020, FLC develops semiconductor and display equipment and components. We focus on equipment development, domestic component manufacturing and custom engineering.

Company
ESTABLISHED2020.07.20
DEVELOPMENTEquipment · Parts · Materials
CAPABILITIESDesign, manufacturing & technical support

CONNECT WITH FLC

Better semiconductor processes, developed together.

Contact us